Has good high frequency and low frequency dielectric properties
Excellent thermal shock resistance, good moisture resistance
Excellent optical transmission capability for solar installations
The cured coating has good weather resistance and UV resistance
Designed for applications which demand a strong but flexible bond, such as when
bonding materials with differing thermal expansion rates, e.g. glass to metal or glass to
Unprimed adhesion to commonly used materials including enameled and painted steel,
aluminum, ceramic and glass as well as to certain plastics used in engineering
Used as a Formed-in-Place Gasket (FIPG) material.
All surfaces should be thoroughly cleaned and/or degreased with DOWSIL™ brand OS
Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent.
Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any
oils remaining on the surface may interfere with adhesion. Light surface abrasion is
recommended whenever possible, because it promotes good cleaning and increases the
surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some
cleaning techniques may provide better results than others; users should determine the best
techniques for their particular applications.
Dow one-part moisture cure adhesives are generally cured at room temperature and in an
environment of 30 to 80 percent relative humidity eliminating the need for curing ovens and
the associated costs of energy and capital. Greater than 90 percent of full physical
properties should be attained within 24 to 72 hours and varies according to product. Faster
manufacturing throughput can be achieved since the adhesive and component can be
handled in much shorter times of about 10 to 120 minutes, depending on the adhesive
selected and the amount applied. These adhesives are not typically used in highly confined
spaces or where a deep section cure is required as they generally cure from the exposed
surface inward at a rate of 0.25 inch per seven days. Cure progresses from the outer
exposed surface and is dependent on the moisture in the air. Working time is generally a
few minutes to an hour for these products until a surface skin begins to form. Mild heat
below 60°C (140°F) may be used to increase through-put by accelerating the cure. Dow
silicone adhesives retain their original physical and electrical properties over a broad range
of operating conditions which enhance the reliability of and service life of devices. The
stable chemistry and versatile processing options of these adhesives offer benefits for a
variety of device assembly needs from increasing component safety and reliability, reducing
total cost or increasing the performance envelope of devices or modules. Underwriters
Laboratory (UL) 94 recognition is based on minimum thickness requirements. Please
consult the UL Online Certifications Directory for the most accurate certification information
Dow Corning 1-4105 Conformal Coating Low viscosity, low temperature fast curing, heat curing, transparent coating single component, solvent-free elastomer, fast heating curing, transparent, resistant to moisture and other harsh environments; good dielectric properties.
High strength: fully cured after the tensile and tear strength, and has good resistance to moisture, anti-corona, anti-ozone performance.
No collapse: high viscosity, no sag after coating, no collapse after curing.