Cemedine EP007 Epoxy Resin Adhesive glue

Cemedine EP007 Epoxy Resin Adhesive glue

Features

  1. Reactive adhesive
  2. Solventless
  3. No gas produced during curing process
  4. Excellent adhesive strength
  5. Excellent heat and chemicals resistance
  6. Small shrinkage by curing
  7. Small creep under load
  8. Excellent durability
  9. Superb insulation

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描述

Features

  1. Reactive adhesive
  2. Solventless
  3. No gas produced during curing process
  4. Excellent adhesive strength
  5. Excellent heat and chemicals resistance
  6. Small shrinkage by curing
  7. Small creep under load
  8. Excellent durability
  9. Superb insulation                                            Application

Applicable to adherents over an extensive range including metals and plastics

• Adhesion of cars, vehicles, vessels and aircraft • Adhesion and sealing of electric equipment and electronic parts
• Adhesion of composite members for construction • Assembly of precision equipment and art works
• Adhesion of sporting equipment

Adhesive strength for various types of materials