Cemedine EP007 Epoxy Resin Adhesive glue
Features
- Reactive adhesive
- Solventless
- No gas produced during curing process
- Excellent adhesive strength
- Excellent heat and chemicals resistance
- Small shrinkage by curing
- Small creep under load
- Excellent durability
- Superb insulation
- 描述
- Global Tab
描述
Features
- Reactive adhesive
- Solventless
- No gas produced during curing process
- Excellent adhesive strength
- Excellent heat and chemicals resistance
- Small shrinkage by curing
- Small creep under load
- Excellent durability
- Superb insulation Application
Applicable to adherents over an extensive range including metals and plastics
• Adhesion of cars, vehicles, vessels and aircraft | • Adhesion and sealing of electric equipment and electronic parts |
• Adhesion of composite members for construction | • Assembly of precision equipment and art works |
• Adhesion of sporting equipment |
Adhesive strength for various types of materials