CEMEDINE EP330 Two-liquid mixed reactive epoxy system. Rapid curing type
Reactive solvent-free adhesive.
Hardening and shrinkage is small.
High adhesion and durability.
- Global Tab
Bonding and sealing of motor and electronic components.
Bonding of building composite components.
The assembly of precision instruments, handicrafts, etc.
[contact-form-7 id=”74″ title=”Contact Form – Basic”