Dow Corning PR-1200RTV primer silicone special primer can be used on all silicone rubbers
Dow CORNING 1200 PRIMER IS A SOLUTION-BASED PRODUCT THAT DILUTES THE REACTIVE MATERIAL THAT PROMOTES SILICONE ADHESIVE ADHESION IN A SOLVENT THAT DRIES WHEN EXPOSED TO AIR.
Dow Corning 1200 primers promote adhesion of specific one-component Silicone sealant to construction materials such as plywood, masonry, and metals.
- 描述
- Global Tab
描述
When APPLYING Dow Corning 1200 PRIMER, the following steps must be followed to obtain the bonding effect:
All dust, dirt, oil stains and other impurities must be completely removed on the surface of the sealant. Use sandpaper or a wire brush to scrub or remove rust from metal surfaces. The masonry surface should be brushed clean with a wire brush, while dust is blown away with high pressure air.
◆ With a clean cloth that does not contain oil stained with petroleum brain (Naphtha), Mineral Spirits, Xylene, Toluene or methyl acetylene (MEK) and other industrial solvents, the material surface oil thoroughly wipe wipe.
◆ Apply Dow Corning 1200 primer to a clean, dry building surface using a cloth, brush, or spritzer. Approximately 400 square feet per gallon can be applied to materials with rough or porous surfaces, and 800 square feet per gallon for smooth metal or plastic surfaces.
Let the solvent contained in the primer completely volatilize. The duration of evaporation depends on temperature, humidity and the porosity of the coating material.
◆ Apply Silicone construction sealant according to instructions.
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to the heat sink or chassis, thereby increasing the overall efficiency of the device. or PCB system assemblies are continually designed to deliver higher performance. Especially in the area of consumer devices, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers. A cooler device allows for more efficient operation and better reliability over the life of the device. As such, thermally conductive compounds play an integral role here. Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink). These materials have properties such as low thermal resistance, high thermal conductivity, and can achieve thin Bond Line Thicknesses (BLTs) which can help to improve the transfer of heat away from the device.
