DOWSIL Corning CN-8760G heat conduction potting adhesive power supply sealant electronic polyurethane adhesive heat dissipating adhesive

  • DOWSIL Corning CN-8760G heat conduction potting adhesive power supply sealant electronic polyurethane adhesive heat dissipating adhesive
1
2
3
1
2
3

DOWSIL Corning CN-8760G heat conduction potting adhesive power supply sealant electronic polyurethane adhesive heat dissipating adhesive

DOWSIL CN-8880 white thermal conductive silicone computer CPU graphics card heat dissipation paste thermal conductive silicone
Araldite AV138/HV998 glue two component epoxy AB structure gemstone sealing glue

Typical characteristic
Curing characteristics: heat curing >100C, extended working time >20 minutes at room temperature
Characteristic: Mild thermal conductivity, UL approved
Special properties: Heat conduction, UL certification
Durometer/Hardness: Medium hardness 20A-50A
Viscosity/flow: Control flow 3000-10,000 cps
Two parts
Room temperature curing: >24 hours

分类：
  • 描述
  • Global Tab

描述

Dow Corning CN-8760G Potting glue

Applications: encapsulation of electronic components, modules, such as transformers, power supplies, network filtering, etc. Protection requires dielectric insulation, shock resistance, vibration resistance of electronic components; Application in automotive electronics, sensitive element protection.

Stability: can play the role of moisture-proof, dustproof, anti-corrosion, shock-proof, sealing, anti-theft, and improve the performance and stability parameters.

相关产品