Dowsil corNING SC102 ELECTRONIC IC chip thermal grease heat sink

Dow one-part moisture cure adhesives are generally cured at room temperature and in an
environment of 30 to 80 percent relative humidity eliminating the need for curing ovens and
the associated costs of energy and capital. Greater than 90 percent of full physical
properties should be attained within 24 to 72 hours and varies according to product. Faster
manufacturing throughput can be achieved since the adhesive and component can be
handled in much shorter times of about 10 to 120 minutes, depending on the adhesive
selected and the amount applied. These adhesives are not typically used in highly confined
spaces or where a deep section cure is required as they generally cure from the exposed
surface inward at a rate of 0.25 inch per seven days. Cure progresses from the outer
exposed surface and is dependent on the moisture in the air. Working time is generally a
few minutes to an hour for these products until a surface skin begins to form. Mild heat
below 60°C (140°F) may be used to increase through-put by accelerating the cure. Dow
silicone adhesives retain their original physical and electrical properties over a broad range
of operating conditions which enhance the reliability of and service life of devices. The
stable chemistry and versatile processing options of these adhesives offer benefits for a
variety of device assembly needs from increasing component safety and reliability, reducing
total cost or increasing the performance envelope of devices or modules. Underwriters
Laboratory (UL) 94 recognition is based on minimum thickness requirements. Please
consult the UL Online Certifications Directory for the most accurate certification information