Emerson&Cuming Eccobond G757

Emerson&Cuming Eccobond G757

ECCOBOND G757 is a one-component, thixotropic good flexible thermosetting epoxy adhesive. 40C ~ 160C, G757 showed good flexibility, reduce and absorb stress. Heat curing, can be a good bond glass, steel, copper, aluminum and FRP

Add to wish list
分类: ,
  • 描述
  • Global Tab

描述

ECCOBOND G757 is a one-component, thixotropic good flexible thermosetting epoxy adhesive. 40C ~ 160C, G757 showed good flexibility, reduce and absorb stress. Heat curing, can be a good bond glass, steel, copper, aluminum and FRP.

Get free sample or more information , please contact me with my email: jenny@fuji-hk.cn . thank you .

Contact Us