Henkel LOCTITE UV9060F UV moisture double curing adhesive Acrylic resin High thixotropic
LOCTITE ECCOBOND UV 9060F, acrylic resin, UV/ moisture dual cure system, high thixotropic, fluorescent detection, component encapsulation and chip corner reinforcement
- 描述
- Global Tab
描述
LOCTITE® ECCOBOND UV 9060F is an encapsulation material developed for circuit board protection. It offers non-flow resistance and dual UV/ moisture curing. This product is fluorescent and can be viewed under ultraviolet lamp (black light lamp).
Rapid curing
Cure in shaded areas
Easy to distribute, no strings
It fluoresces under ultraviolet light
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LOCTITE 403 is a medium viscosity, low odor, low albino, alkoxyethyl transient dry adhesive suitable for use in difficult vapor control situations. It can quickly bond to a variety of materials, including metals, plastics and elastomers. Especially suitable for bonding porous or absorbent materials.
Product Features
1. Low odor, suitable for situations where steam control is essential
2. Low bleaching, suitable for the manufacture of cosmetics
3. Colorless and transparent
4. Very suitable for porous substrates
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flexible PVC to polycarbonate where large gap filling
capabilities and flexible joints are desired. The product has
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LOCTITE EA E-120HP epoxy structural adhesive High strength metal plastic adhesive solvent resistant
- Product Name: LOCTITE EA E-120HP
Product specification: 50ml
Composition: Two components
Appearance (not cured): Amber
Viscosity (mpa.s): resin :41000~61000 curing agent :2000~4000
Tolerance temperature (℃): -55~120℃
Operation time: 120 minutes
Curing method: mixed room temperature curing
Chemical type: epoxy resin
Application characteristics: Two component industrial grade epoxy resin adhesive. It cures at room temperature to form a tough adhesive layer with excellent peel resistance and impact resistance.
- Product Name: LOCTITE EA E-120HP
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LOCTITE 243 medium strength Threadlocking Adhesive
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LOCTITE 416 general purpose cyanoacrylate instant adhesive.
The rate of cure will depend on the bondline gap. Thin bond
lines result in high cure speeds, increasing the bond gap will
decrease the rate of cure.
