Loctite 3609SMT red adhesive for high temperature electronic components chip scraping steel mesh printing adhesive
Material properties before curing
Typical value range
Chemical type epoxy resin
The appearance is orange liquid
Specific gravity @250C, 1.3
Viscosity @250C, mPa.s
BrookfieldHBT
TD rotor, 1 RPM 1,500,750,000-2,250,000
10 RPM 375,000 250,000-500,000
DIN 54453,SV
D=20S-1
t=180 seconds 75,000 50,000-100,000
Viscometer data @230C
Haake PK100,M10/PK
1 20
Cone
Casson Model over 0.4-30 1/s
- 描述
- Global Tab
描述
Loctite 3609 patch adhesive is a one-component epoxy adhesive that quickly cures after being heated
It has many advantages:
1. Excellent thixotropic performance and no air state make it very suitable for high-speed SMT machine dispensing
2. Good glue point shape control
3. The appropriate curing condition is heating at a temperature above 100℃
Typical use
SMD components can be bonded to printed circuit boards using this product prior to wave soldering. Especially suitable for high speed SMD SMT machine. Its low hygroscopicity allows it to be exposed to the open storage tank for a longer period of time without affecting the coating performance or causing holes in the cured adhesive.