Loctite 3609SMT red adhesive for high temperature electronic components chip scraping steel mesh printing adhesive

Loctite 3609SMT red adhesive for high temperature electronic components chip scraping steel mesh printing adhesive

Material properties before curing

Typical value range

Chemical type epoxy resin

The appearance is orange liquid

Specific gravity @250C, 1.3

Viscosity @250C, mPa.s

BrookfieldHBT

TD rotor, 1 RPM 1,500,750,000-2,250,000

10 RPM 375,000 250,000-500,000

DIN 54453,SV

D=20S-1

t=180 seconds 75,000 50,000-100,000

Viscometer data @230C

Haake PK100,M10/PK

1 20

Cone

Casson Model over 0.4-30 1/s

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  • 描述
  • Global Tab

描述

Loctite 3609 patch adhesive is a one-component epoxy adhesive that quickly cures after being heated

It has many advantages:

1. Excellent thixotropic performance and no air state make it very suitable for high-speed SMT machine dispensing

2. Good glue point shape control

3. The appropriate curing condition is heating at a temperature above 100℃

Typical use

SMD components can be bonded to printed circuit boards using this product prior to wave soldering. Especially suitable for high speed SMD SMT machine. Its low hygroscopicity allows it to be exposed to the open storage tank for a longer period of time without affecting the coating performance or causing holes in the cured adhesive.