Original authentic Dow Corning 1-2620 three anti paint conformal coating elastoplastic coating protection glue
Curing time: 72 hours Dielectric strength: 450 Hardness: 25 D Burning point: 13℃ RTDry time: 20 min Operating temperature: -45 to 200℃ Curing system: RTV RTDry time: 1-24 hours
- 描述
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描述
Dow Corning 1-2620 is a 135cP, one-component product with a full cure time of 24 to 72 hours
Used in the electronics industry, military electronic equipment, electronic equipment, electronic instrumentation, sanitary equipment, appliances, electrical appliances, digital cameras, waterproof cell phone, pay phone, air conditioning, electronic scales, electronic original passive, auto electric parts, etc. (performance: waterproof, moisture-proof, dustproof, anti-corrosion, shock, character of aging proof, Widely used in circuit board, electronic equipment insulation protection glue; Simple operation: spraying, brush coating, dip coating)
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Specification: 15 kg
Shelf life :24 months
Curing speed: full solid 24 hours
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Dow Corning TC-5351 automotive heating assembly heat dissipation does not flow thermal grease
Product color Gray
Operating temperature -50°C to 200°C
Thermal conductivity 3.3W/m.K
The product specification is 1KG
The warranty date is 12 months
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Dow corning DOWSIL™ 744 RTV Adhesive Sealant
Dow one-part moisture cure adhesives are generally cured at room temperature and in an
environment of 30 to 80 percent relative humidity eliminating the need for curing ovens and
the associated costs of energy and capital. Greater than 90 percent of full physical
properties should be attained within 24 to 72 hours and varies according to product. Faster
manufacturing throughput can be achieved since the adhesive and component can be
handled in much shorter times of about 10 to 120 minutes, depending on the adhesive
selected and the amount applied. These adhesives are not typically used in highly confined
spaces or where a deep section cure is required as they generally cure from the exposed
surface inward at a rate of 0.25 inch per seven days. Cure progresses from the outer
exposed surface and is dependent on the moisture in the air. Working time is generally a
few minutes to an hour for these products until a surface skin begins to form. Mild heat
below 60°C (140°F) may be used to increase through-put by accelerating the cure. Dow
silicone adhesives retain their original physical and electrical properties over a broad range
of operating conditions which enhance the reliability of and service life of devices. The
stable chemistry and versatile processing options of these adhesives offer benefits for a
variety of device assembly needs from increasing component safety and reliability, reducing
total cost or increasing the performance envelope of devices or modules. Underwriters
Laboratory (UL) 94 recognition is based on minimum thickness requirements. Please
consult the UL Online Certifications Directory for the most accurate certification information -
Dowsil corNING SC102 ELECTRONIC IC chip thermal grease heat sink
A white, non – cured, non – flowing, heat – conducting compound. Designed to provide efficient heat transfer for cooling of computer power supplies and electronic modules used in automotive applications
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DOWSIL CN-8880 white thermal conductive silicone computer CPU graphics card heat dissipation paste thermal conductive silicone
Dow thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low
bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device or PCB system assemblies
to the heat sink or chassis, thereby increasing the overall efficiency of the device. or PCB system assemblies are continually designed to deliver higher performance. Especially in the area of consumer devices, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers. A cooler device allows for more efficient operation and better reliability over the life of the device. As such, thermally conductive compounds play an integral role here. Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink). These materials have properties such as low thermal resistance, high thermal conductivity, and can achieve thin Bond Line Thicknesses (BLTs) which can help to improve the transfer of heat away from the device.
