Aron Alpha 802 Instant Sol
The characteristics of this super-glue is no need to mix at room temperature can quickly bond a variety of materials, and strong adhesion, a small amount of instantaneous bonding can be a large area. Aaron hair AA super glue itself transparent, so that the appearance of adhesive objects beautiful. Plus resistance to chemicals, heat resistance, good water resistance, can guarantee lasting adhesion. Widely used, easy to use, really fast super glue.
aron alpha 401xz glue
AA super-glue 401XZ improved quick-drying plastic brittle, not high temperature shortcomings, to achieve high temperature conditions, the stability of viscosity. Has excellent impact resistance and suitable for bonding with metal, especially for auto parts, metal parts, brake lever.
Dow corning DOWSIL™ 732 Multi-Purpose Sealant
All surfaces should be thoroughly cleaned and/or degreased with DOWSIL™ brand OS
Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent.
Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any
oils remaining on the surface may interfere with adhesion. Light surface abrasion is
recommended whenever possible, because it promotes good cleaning and increases the
surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some
cleaning techniques may provide better results than others; users should determine the best
techniques for their particular applications.
Dow corning DOWSIL TC-5026 Thermally Conductive Compound
Dow thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low
bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device or PCB system assemblies
to the heat sink or chassis, thereby increasing the overall efficiency of the device. or PCB system assemblies are continually designed to deliver higher performance. Especially in the area of consumer devices, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers. A cooler device allows for more efficient operation and better reliability over the life of the device. As such, thermally conductive compounds play an integral role here. Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink). These materials have properties such as low thermal resistance, high thermal conductivity, and can achieve thin Bond Line Thicknesses (BLTs) which can help to improve the transfer of heat away from the device.