AA888 ARON ALPHA TYPE 412XZ provides rapid bonding on a wide range of materials including metals, plastics and elastomers.
- For Wood Work: Suitable for bonding wood. Complete and wide range of adhesive grades available. Suitable for assembling wooden products and repairing. Wooden molds and expensive rare woods.
- Artificial Marble: For use on artificial marble with various kinds of colors such as transparent, white, black and grey.
- Color Grades: Able to confirm the coating colors of adhesives.
- Remover: For use in removing hardened substances and peel off parts of adhesives
- 描述
- Global Tab
描述
- Expose the adhesives in the containers to moisture and light to let it harden slowly, and to treat it as waste plastics (drastic hardening may result in heating, pay attention to this situation).
- Please comply with local regulations when dispos
- Fast setting to various materials
- Good bonding strength to various materials (especially metal)
- Good tensile shear strength under heated conditions or after heating
- High impact strength
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- Room temperature cure, no ovens required
- Faster in-line processing with optional heat acceleration
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- UL 94 V-1, IPC-CC-830 and MIL-A-46146 tested
- Can be considered for uses requiring added flame resistance, IPC or Mil Spec testing
- UL 746E / UL746C Recognized
- UV indicator for manual and automated inspection
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Aron Alpha 802 Instant Sol
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aron alpha 401xz glue
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Dow corning DOWSIL™ 732 Multi-Purpose Sealant
All surfaces should be thoroughly cleaned and/or degreased with DOWSIL™ brand OS
Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent.
Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any
oils remaining on the surface may interfere with adhesion. Light surface abrasion is
recommended whenever possible, because it promotes good cleaning and increases the
surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some
cleaning techniques may provide better results than others; users should determine the best
techniques for their particular applications. -
Dow corning DOWSIL TC-5026 Thermally Conductive Compound
Dow thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low
bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device or PCB system assemblies
to the heat sink or chassis, thereby increasing the overall efficiency of the device. or PCB system assemblies are continually designed to deliver higher performance. Especially in the area of consumer devices, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers. A cooler device allows for more efficient operation and better reliability over the life of the device. As such, thermally conductive compounds play an integral role here. Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink). These materials have properties such as low thermal resistance, high thermal conductivity, and can achieve thin Bond Line Thicknesses (BLTs) which can help to improve the transfer of heat away from the device.
