ALPHA Alpha Solder Paste OM-340 Eco-friendly lead-free halogen-free low temperature electronic solder paste clean free
Maximizes the return yield from lead-free processes, achieving excellent print consistency across the board alloy coalescence with circular diameter openings as small as 200pm (8 mil) and 100m (4 mi) mesh thickness. High process capability index printing speed up to 150mm/sec (6 “/s) in all PCB designs ensures fast printing cycle time and high output the extensive reflux curve window ensures good weldability on the surface treatment of different sheets/parts excellent paste and flux appearance after reflow welding
Excellent anti-headrest defect performance
The industry’s best on – line needle yield measurement
Reduce random ball level, reduce repair and improve first pass rate
Comply with IPC7095 void performance of the highest grade · Class III
Excellent reliability, halide free
Nitrogen or air reflux is applicable
Completely halogen-free (no halogenated rhomb is deliberately added to the recipe)
- Global Tab
ALPHA OM-340 is a widely used, lead-free, no-wash weld. ALPHA OM-340 solder paste provides similar performance to the tin process. ALPHA OM-340 solder paste achieved the industry’s best headrest defect prevention performance and first time qualified yield in online testing. The ALPHA OM-340 demonstrates excellent printing performance, especially in applications with ultra-fine spacing repeatability (11 ml square) and high yield requirements.
The excellent reflux process window guarantees the excellent coalescence of various deposition sizes and the excellent performance of preventing random solder balls and tin beads from being produced on CuOSP materials. The ALPHA OM-340 provides excellent solder joint appearance and the industry’s best online needle yield measurement. In addition, the ALPHA OM-340’s PC Class M void capability and ROLOIPC classification guarantee the best long-term reliability.