DOWSIL OS-20 Odorless environmental protection thinner Insulation coating three – resistant paint
Brand: Dow Corning
Model: OS – 20
Origin: USA
Specification: 15 kg
Shelf life :24 months
Curing speed: full solid 24 hours
Curing type: self-drying type
DOWSIL 1-2620 Low VOC Conformal Coating version is supplied with a lower VOC content compared to that of the DOWSIL 1-2620 Dispersion and has equivalent Mil spec, IPC-CC-830 and UL recognitions.
RTV elastoplastic conformal coatings have firm, dry surfaces for better handling and
abrasion resistance after cure. Various viscosity versions facilitate different application
methods. They require atmospheric moisture to cure (no ovens) and their cure rates can be
accelerated by mild heat. Conformal coatings are materials applied in thin layers onto
printed circuits boards or other PCB system assembly substrates
Dow corning DOWSIL™ 732 Multi-Purpose Sealant
All surfaces should be thoroughly cleaned and/or degreased with DOWSIL™ brand OS
Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent.
Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any
oils remaining on the surface may interfere with adhesion. Light surface abrasion is
recommended whenever possible, because it promotes good cleaning and increases the
surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some
cleaning techniques may provide better results than others; users should determine the best
techniques for their particular applications.
Dow corning DOWSIL™ CN-8880 Thermal Grease ,thermally conductive silicone paste
Dow thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low
bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device or PCB system assemblies
to the heat sink or chassis, thereby increasing the overall efficiency of the device. or PCB system assemblies are continually designed to deliver higher performance. Especially in the area of consumer devices, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers. A cooler device allows for more efficient operation and better reliability over the life of the device. As such, thermally conductive compounds play an integral role here. Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink). These materials have properties such as low thermal resistance, high thermal conductivity, and can achieve thin Bond Line Thicknesses (BLTs) which can help to improve the transfer of heat away from the device.
DOWCORING 1-2577 hot melt adhesive
Dow corning DC1-2577 conformal coating is a kind of transparent silicone resin, has good high frequency and low frequency dielectric properties, compared with the previous common silicone resin has better thermal shock resistance.