Dow corning DOWSIL™ SE 4420 Thermally Conductive Adhesive

Dow corning DOWSIL™ SE 4420 Thermally Conductive Adhesive

  • One-part RTV-cure thermally  conductive materials cure with moisture exposure to produce durable, relatively low-stress elastomer with a noncorrosive by-product. PCB system
    assemblies are continually designed to deliver higher performance. Especially in the area of consumer devices, there is also a continual trend  towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers.

  • 描述
  • Global Tab

描述

One part, white, moisture cure, thermally conductive silicone adhesive
• DOWSIL™ SE 4420 Thermally Conductive Adhesive is designed to provide efficient thermal transfer for the cooling of modules, including  telecom and power supply devices.

FEATURES & BENEFITS
• One part material
• Semi-flowable
• Fast tack-free time
• Good adhesion
• Thermally conductive
COMPOSITION
• Thermally conductive filler
• Polydimethylsiloxane adhesive

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