Dow corning DOWSIL SE 4450 Thermally Conductive Adhesive

Dow corning DOWSIL SE 4450 Thermally Conductive Adhesive

Dow thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low
bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device or PCB system assemblies
to the heat sink or chassis, thereby increasing the overall efficiency of the device. or PCB  system assemblies are continually designed to deliver higher performance. Especially in the area of consumer devices, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers. A cooler device allows for more efficient operation and better  reliability over the life of the device. As such, thermally conductive compounds play an integral role here. Thermally conductive materials act as a thermal “bridge” to remove heat  from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink). These materials have properties such as low thermal resistance, high thermal conductivity, and can achieve thin Bond Line Thicknesses (BLTs) which can help to improve the transfer of heat away from the device.

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DOWSIL™ SE 4450 Thermally Conductive Adhesive is a one part, gray, flowable thermally  conductive adhesive with high tensile strength
Features & Benefits
 One part material – no mixing of separate components
 Solventless formulation
 Flowable – able to fill and self-level after dispensing
 Versatile heat cure
 High tensile strength
 Thermally conductive – removes heat from sensitive components
Composition  Thermally conductive filler
 Polydimethylsiloxane adhesive
Applications  Designed to provide efficient thermal transfer for the cooling of chip packaging as TIM 1

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