DOWSIL EA 9189 H fast tack free, flowable silicone adhesive with controlled volatility and good flame resistance.
Typical Properties
- ColorWhite
- Cure CharacteristicsRoom Temperature Fast Tack-Free < 10 min
- Dielectric Constant at 100 Hz3.2
- Dielectric Constant at 100 kHz2.7
- Dielectric Strength20 kV/mm
- Dissipation Factor at 100 Hz0.08
- Elongation50 %
- Non-SlumpYes, Yes
- 描述
- Global Tab
描述
One-part moisture cure silicone adhesive
Features &
Benefits
• Ease to use – no mixing, no heating, no exothermic heat during cure, no added solvents
• Neutral cure
• Excellent unprimed adhesion to many substrates
• Broad temperature range performance from -45 to +200°C
• Fast cure
Applications • Sensitive PCB system devices requiring very low volatiles in a higher durometer
sealant/adhesive.
• Sealant/adhesive used in sensitive PCB system devices requiring moderate thermal
management performance.
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Allow solvents to completely evaporate before applying the primer
