Japan’s solder paste ECCSOLDER thousand live solder paste high-temperature lead-free solder paste environmental protection without halogen tin solder paste to climb
High activity/high reliability
Imported tin powder density uniform solder joint full, bright low residue, strong welding force good conductivity, air raid shelter is suitable for high temperature pre-potential printing stability, low residue, SMT reflux welding and other operations.
- Global Tab
Lead-free solder paste & Features
Solder paste is a mixture of active flux and non – oxidized spherical powder, used for the surface of the circuit board. The lead-free solder paste developed by Qianzhu Metal is composed of welding powder with minimal surface oxidation and flux with superior chemical stability. It not only has high reliability, good preservation stability, but also has good weldability. It is characterized that there is almost no fine solder ball after welding. But also to solve the high melting point caused by the heat resistance and other problems, is a new generation of environmental protection corresponding to the new lead-free solder paste products.