KONISHI SL220LB single component room temperature curing elastic adhesive epoxy glue
No tin compound was used.
One-component room temperature curable elastic adhesive.
Six substances (cadmium, lead, mercury, hexavalent chromium and its compounds, PBB and PBDE) specified by RoHS are not used.
Polysiloxane-free: It does not contain low molecular cyclic polysiloxane which causes contact barrier.
It can also be used for filling bonding (internal hardening takes time).
Because it is an elastomer, it has little deformation to the bonding parts and strong cold and hot shock resistance
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It can be used for bonding various materials. Adhesion of various hard plastic materials such as polycarbonate and ABS resin and adhesion of metal materials.
Adhesion requiring initial adhesive strength.
Adhesion between hard materials with different thermal expansion coefficients.