LOCTITE 406 designed for bonding of plastics and elastomeric materials where very fast fixturing is required

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  • LOCTITE 406 designed for bonding of plastics and elastomeric materials where very fast fixturing is required
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LOCTITE 406 designed for bonding of plastics and elastomeric materials where very fast fixturing is required

LOCTITE EDAG PF 407A E&C polymer thick film is designed for production of low voltage circuitry on polyester film and solvent sensitive substrates such as polycarbonate
LOCTITE 326 typical applications include bonding ferrites to plated materials in electric motors, loudspeaker hardware and jewelry where fast fixturing is required.

Cure Speed vs. Humidity
The rate of cure will depend on the ambient relative
humidity. The best results are achieved when the relative
humidity in the working environment is 40% to 60% at 22°C.
Lower humidity leads to slower cure. Higher humidity
accelerates it, but may impair the final strength of the bond.

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TYPICAL CURING PERFORMANCE
Under normal conditions, the atmospheric moisture initiates the
curing process. Although full functional strength is developed
in a relatively short time, curing continues for at least 24 hours
before full chemical/solvent resistance is developed.

 

 

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