DOWSIL Corning CN-8760G heat conduction potting adhesive power supply sealant electronic polyurethane adhesive heat dissipating adhesive
Curing characteristics: heat curing >100C, extended working time >20 minutes at room temperature
Characteristic: Mild thermal conductivity, UL approved
Special properties: Heat conduction, UL certification
Durometer/Hardness: Medium hardness 20A-50A
Viscosity/flow: Control flow 3000-10,000 cps
Room temperature curing: >24 hours
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Dow Corning CN-8760G Potting glue
Applications: encapsulation of electronic components, modules, such as transformers, power supplies, network filtering, etc. Protection requires dielectric insulation, shock resistance, vibration resistance of electronic components; Application in automotive electronics, sensitive element protection.
Stability: can play the role of moisture-proof, dustproof, anti-corrosion, shock-proof, sealing, anti-theft, and improve the performance and stability parameters.