Dow corning DOWSIL™ 795 Silicone Building Sealant
- Highly resistant to weather, UV and temperature extremes
- One-part, medium-modulus neutral-cure adhesive/sealant silicone material
- Supports glass and other panel materials under high wind load
- Weatherproofs substrates such as glass, aluminum, steel, painted metal, EIFS, granite & other stone, concrete, brick, plastic
- Ready to use as supplied with all-temperature gunnability, easy tooling and low-odor curing
- 描述
- Global Tab
描述
- Suitable for most new construction and remedial sealing applications
- Structural and nonstructural glazing
- Structural attachment of many panel systems
- Panel stiffener applications
- Weather sealing of most common construction materials including glass, aluminum, steel, painted metal, EIFS, granite and other stone, concrete, brick and plastics
相关产品
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Dow corning DOWSIL™ SE 4420 Thermally Conductive Adhesive
- One-part RTV-cure thermally conductive materials cure with moisture exposure to produce durable, relatively low-stress elastomer with a noncorrosive by-product. PCB system
assemblies are continually designed to deliver higher performance. Especially in the area of consumer devices, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers.
- One-part RTV-cure thermally conductive materials cure with moisture exposure to produce durable, relatively low-stress elastomer with a noncorrosive by-product. PCB system
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Dow corning DOWSIL™ 744 RTV Adhesive Sealant
Dow one-part moisture cure adhesives are generally cured at room temperature and in an
environment of 30 to 80 percent relative humidity eliminating the need for curing ovens and
the associated costs of energy and capital. Greater than 90 percent of full physical
properties should be attained within 24 to 72 hours and varies according to product. Faster
manufacturing throughput can be achieved since the adhesive and component can be
handled in much shorter times of about 10 to 120 minutes, depending on the adhesive
selected and the amount applied. These adhesives are not typically used in highly confined
spaces or where a deep section cure is required as they generally cure from the exposed
surface inward at a rate of 0.25 inch per seven days. Cure progresses from the outer
exposed surface and is dependent on the moisture in the air. Working time is generally a
few minutes to an hour for these products until a surface skin begins to form. Mild heat
below 60°C (140°F) may be used to increase through-put by accelerating the cure. Dow
silicone adhesives retain their original physical and electrical properties over a broad range
of operating conditions which enhance the reliability of and service life of devices. The
stable chemistry and versatile processing options of these adhesives offer benefits for a
variety of device assembly needs from increasing component safety and reliability, reducing
total cost or increasing the performance envelope of devices or modules. Underwriters
Laboratory (UL) 94 recognition is based on minimum thickness requirements. Please
consult the UL Online Certifications Directory for the most accurate certification information -
Dow corning DOWSIL TC-5026 Thermally Conductive Compound
Dow thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low
bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device or PCB system assemblies
to the heat sink or chassis, thereby increasing the overall efficiency of the device. or PCB system assemblies are continually designed to deliver higher performance. Especially in the area of consumer devices, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers. A cooler device allows for more efficient operation and better reliability over the life of the device. As such, thermally conductive compounds play an integral role here. Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink). These materials have properties such as low thermal resistance, high thermal conductivity, and can achieve thin Bond Line Thicknesses (BLTs) which can help to improve the transfer of heat away from the device. -
Dow Corning 1-2620 general purpose silicone sealant
performance: waterproof, moisture, dust, Anti-corrosion, anti-aging, and other characteristics, widely used in circuit boards, electronic equipment, insulation protective adhesive, electronic components, electronic scales, electronic passive parts, automotive electronic control, etc.; )
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DOWSIL 3145 RTV MIL-A-46146 Adhesive/Sealant – Gray
DOWSIL 3145 RTV MIL-A-46146 Adhesive/Sealant – Gray is suitable for:
Sealing openings in modules and housings
Adding mechanical stability to individual components
Assembly of components on PWBs
Sealing in and around wired and electrical leads Yoke assembly
