Dow coring

  • DoW coring glue 1-2577 full range of adhesive glue

    Has good high frequency and low frequency dielectric properties
    Excellent thermal shock resistance, good moisture resistance
    Excellent optical transmission capability for solar installations
    The cured coating has good weather resistance and UV resistance

  • Dow corning DOWSIL SE 4450 Thermally Conductive Adhesive

    Dow thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low
    bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device or PCB system assemblies
    to the heat sink or chassis, thereby increasing the overall efficiency of the device. or PCB  system assemblies are continually designed to deliver higher performance. Especially in the area of consumer devices, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers. A cooler device allows for more efficient operation and better  reliability over the life of the device. As such, thermally conductive compounds play an integral role here. Thermally conductive materials act as a thermal “bridge” to remove heat  from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink). These materials have properties such as low thermal resistance, high thermal conductivity, and can achieve thin Bond Line Thicknesses (BLTs) which can help to improve the transfer of heat away from the device.

  • Dow corning DOWSIL TC-5026 Thermally Conductive Compound

    Dow thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low
    bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device or PCB system assemblies
    to the heat sink or chassis, thereby increasing the overall efficiency of the device. or PCB  system assemblies are continually designed to deliver higher performance. Especially in the area of consumer devices, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers. A cooler device allows for more efficient operation and better  reliability over the life of the device. As such, thermally conductive compounds play an integral role here. Thermally conductive materials act as a thermal “bridge” to remove heat  from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink). These materials have properties such as low thermal resistance, high thermal conductivity, and can achieve thin Bond Line Thicknesses (BLTs) which can help to improve the transfer of heat away from the device.

  • Dow corning DOWSIL™ 3140 RTV Coating

    • One-part no mixing required
    • Good flowability, Able to flow, fill or self-leveling after dispensing
    • Room temperature cure, no ovens required
    • Faster in-line processing with optional heat acceleration
    • No added solvents
    • UL 94 V-1, IPC-CC-830 and MIL-A-46146 tested
    • Can be considered for uses requiring added flame resistance, IPC or Mil Spec testing
    • UL 746E / UL746C Recognized
    • UV indicator for manual and automated inspection
  • Dow corning DOWSIL™ 3165 Fast Tack RTV Adhesive Sealant

    Composition • One-part
    • Polydimethylsiloxane adhesive
    Application Methods
    • Automated or manual needle dispense systems
    Applications • Sealing openings in modules and housings
    • Adding mechanical stability to individual components
    • Assembly of components on PWB/s
    • Sealing in and around wired and electrical leads
    • Yoke assembly

  • Dow corning DOWSIL™ 340 Heat Sink Compound

    Dow thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low
    bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device or PCB system assemblies
    to the heat sink or chassis, thereby increasing the overall efficiency of the device. or PCB  system assemblies are continually designed to deliver higher performance. Especially in the area of consumer devices, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers. A cooler device allows for more efficient operation and better  reliability over the life of the device. As such, thermally conductive compounds play an integral role here. Thermally conductive materials act as a thermal “bridge” to remove heat  from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink). These materials have properties such as low thermal resistance, high thermal conductivity, and can achieve thin Bond Line Thicknesses (BLTs) which can help to improve the transfer of heat away from the device.

  • Dow corning DOWSIL™ 7091 Adhesive Sealant

     Designed for applications which demand a strong but flexible bond, such as when
    bonding materials with differing thermal expansion rates, e.g. glass to metal or glass to
    plastic.
     Unprimed adhesion to commonly used materials including enameled and painted steel,
    aluminum, ceramic and glass as well as to certain plastics used in engineering
    applications.
     Used as a Formed-in-Place Gasket (FIPG) material.

  • Dow corning DOWSIL™ 732 Multi-Purpose Sealant

    All surfaces should be thoroughly cleaned and/or degreased with DOWSIL™ brand OS
    Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent.
    Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any
    oils remaining on the surface may interfere with adhesion. Light surface abrasion is
    recommended whenever possible, because it promotes good cleaning and increases the
    surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some
    cleaning techniques may provide better results than others; users should determine the best
    techniques for their particular applications.

  • Dow corning DOWSIL™ 744 RTV Adhesive Sealant

    Dow one-part moisture cure adhesives are generally cured at room temperature and in an
    environment of 30 to 80 percent relative humidity eliminating the need for curing ovens and
    the associated costs of energy and capital. Greater than 90 percent of full physical
    properties should be attained within 24 to 72 hours and varies according to product. Faster
    manufacturing throughput can be achieved since the adhesive and component can be
    handled in much shorter times of about 10 to 120 minutes, depending on the adhesive
    selected and the amount applied. These adhesives are not typically used in highly confined
    spaces or where a deep section cure is required as they generally cure from the exposed
    surface inward at a rate of 0.25 inch per seven days. Cure progresses from the outer
    exposed surface and is dependent on the moisture in the air. Working time is generally a
    few minutes to an hour for these products until a surface skin begins to form. Mild heat
    below 60°C (140°F) may be used to increase through-put by accelerating the cure. Dow
    silicone adhesives retain their original physical and electrical properties over a broad range
    of operating conditions which enhance the reliability of and service life of devices. The
    stable chemistry and versatile processing options of these adhesives offer benefits for a
    variety of device assembly needs from increasing component safety and reliability, reducing
    total cost or increasing the performance envelope of devices or modules. Underwriters
    Laboratory (UL) 94 recognition is based on minimum thickness requirements. Please
    consult the UL Online Certifications Directory for the most accurate certification information

  • Dow corning DOWSIL™ 795 Silicone Building Sealant

    • Highly resistant to weather, UV and temperature extremes
    • One-part, medium-modulus neutral-cure adhesive/sealant silicone material
    • Supports glass and other panel materials under high wind load
    • Weatherproofs substrates such as glass, aluminum, steel, painted metal, EIFS, granite & other stone, concrete, brick, plastic
    • Ready to use as supplied with all-temperature gunnability, easy tooling and low-odor curing
  • Dow corning DOWSIL™ CN-8880 Thermal Grease ,thermally conductive silicone paste

    Dow thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low
    bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device or PCB system assemblies
    to the heat sink or chassis, thereby increasing the overall efficiency of the device. or PCB  system assemblies are continually designed to deliver higher performance. Especially in the area of consumer devices, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers. A cooler device allows for more efficient operation and better  reliability over the life of the device. As such, thermally conductive compounds play an integral role here. Thermally conductive materials act as a thermal “bridge” to remove heat  from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink). These materials have properties such as low thermal resistance, high thermal conductivity, and can achieve thin Bond Line Thicknesses (BLTs) which can help to improve the transfer of heat away from the device.

  • Dow corning DOWSIL™ SE 4420 Thermally Conductive Adhesive

    • One-part RTV-cure thermally  conductive materials cure with moisture exposure to produce durable, relatively low-stress elastomer with a noncorrosive by-product. PCB system
      assemblies are continually designed to deliver higher performance. Especially in the area of consumer devices, there is also a continual trend  towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers.