Compatherm Paste 9543 a high performance thin bondline thermal paste from Nolato
Nolato thermal paste 9543 is designed to provide efficient heat transfer for cooling of
modern electronics.
Compatherm paste 9543 key properties
− 4.3 W/(mK) thermal conductivity
− Operating temperature -40 to +150˚ C
− Non curing
− Excellent long-time stability
- 描述
- Global Tab
描述
Material Properties
Test procedure Unit 9543
Base material Silicone
Colour Visual Gray
Specific gravity
ASTM D792
(Helium
pycnometer)
g/cm3
(g/cc) 2.3
Viscosity Brookfield T-F at
10 RPM cps 250 000
Minimum achievable bond line Nolato µm 20
Dielectric breakdown voltage ASTM D149 VAC/mm 400
Outgassing, TML 1) ASTM E595
(modified) % 0.3
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Compatherm filler 9343 thermally conductive two-part addition cured compound from Nolato
Applications
The product is used to transfer heat from heat sources, such as components on a
PCB, to a heat sink. Compatherm filler 9343 has the ability to cover various gap
heights and complex geometries with a very low closure force.Compatherm filler key properties 9343
− 4 W/(mK) thermal conductivity
− Operating temperature -40 to +150˚ C
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