Aron alpha aa-setter
An adhesion promoter/accelerator hybrid formulated for use with polyolefins and other low surface energy plastic materials including polypropylene (PP), polyethylene (PE), EPT rubber. This primer not only ensures cure on inactive surfaces but also promotes the cure speed of all ARON ALPA brand cyanoacrylate adhesives. Contains 1% amine accelerator concentration. Fast solvent (n-Heptane) dry time and moderate (1 hour) on-part life.
Aron alpha 232
Moderate viscosity, especially suitable for bonding porous materials, such as wood, leather and sponge-like materials, but also for non-porous material bonding.
Aron Alpha Cyanoacrylate Primers PP Primer
ARON ALPHA PP Primer E is used to make polyolefin and other low surface energy plastics and elastomers suitable for bonding with ARON ALPHA cyanoacrylate (instant) adhesives.
Primers are effective on the following materials:
Polypropylene
Polyethylene
Polyolefin Plastic
Thermoplastic Rubber
Dow corning DOWSIL SE 4450 Thermally Conductive Adhesive
Dow thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low
bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device or PCB system assemblies
to the heat sink or chassis, thereby increasing the overall efficiency of the device. or PCB system assemblies are continually designed to deliver higher performance. Especially in the area of consumer devices, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers. A cooler device allows for more efficient operation and better reliability over the life of the device. As such, thermally conductive compounds play an integral role here. Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink). These materials have properties such as low thermal resistance, high thermal conductivity, and can achieve thin Bond Line Thicknesses (BLTs) which can help to improve the transfer of heat away from the device.