LOCTITE 3619 designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering.

LOCTITE 3619 designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering.

TYPICAL CURING PERFORMANCE
Recommended conditions for curing are exposure to heat
above 100°C (typically 90 to 120 seconds @ 100 °C). Rate of
cure and final strength will depend on the residence time at the
cure temperature.

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描述

LOCTITE 3619 is designed for bonding of surface mounted
devices to printed circuit boards prior to wave soldering.
Particularly suited where low curing temperatures are
required with heat sensitive components, and in applications
where short curing times are required.

 

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